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Embedded Brick Systems

Patent No.: US D704,865 S, US D704,866 S,  US 10,060,143 B2

IMPERIAL

1/2 Bond Meridian - Wire Cut

IMPERIAL

9100XXLWC

1/2 Bond Meridian - Wire Cut

Joint Profile: 

1/4"

Brick Bond:

1/2

1/2 Bond  Meridian

IMPERIAL

9300XXL

1/2 Bond Meridian

Joint Profile: 

1/4"

Brick Bond:

1/2

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